Heat Resistant Polyimide Label for SMT Modules Used during Reflow Soldering

Our heat resistant polyimide label uses 1mil or 2mil polyimide film with acrylic adhesive. The matte white thermal transfer topcoat is easy to read for all kinds of bar codes and other variable information. It can withstand short high temperature up to 350°and long term temperature to 280°. It can be applied on various application such as PCB Board tracking, other bar code tracking, surface protection and masking like wave solder masking, SMT processing, lithium battery or chip packaging protection.

Additional information

Size

Customzied

Color

White

Print Technology

Pre Printed, Thermal Tranfer Printing

Description

Heat Resistant Polyimide Label for SMT Modules Used during Reflow Soldering

Excellent thermal stability, moisture resistance and good initial tack
Extremely high temperature resistance, short-term heat resistance up to 350°C
Adhesive will not degrade when exposed to a wide variety of harsh processing conditions
Withstands reflow, high pressure water washing and cleaning chemicals used in SMT processes
Ideal for marking and traceability of circuit board and electronic components

Applications:

With the polyimide film backing and thermal transfer topcoat, heat resistant polyimide label can apply in high temperature working environment, and the acrylic adhesive will not degrade when exposed to wide range of harsh processing conditions that can ensure the label will not fall off the surface. Featured with easy readability of bar codes and variable information, our high temperature polyimide label can apply on various industry like PCB Board tracking, wave solder reflow, WIFI module, as well as lithium battery.

Heat Resistant Polyimide Label

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