Polyimide Heat Resistant Label for Printed Circuit Board PCB

Can be used in high temperature environments of -40°C~320°C without falling off, deformation, discoloration, and abrasion.
◆Using polyimide film as the base material and coated with special pressure-sensitive adhesive
◆For flux, melting agent and cleaning agent , and other substances have anti-corrosion effect and can be customized.
◆Most of them are used in special industrial environments, such as circuit boards, ES computer motherboards.

This polyimide heat resistant label can be produced according to customer requirements. According to the thickness, there are 25 fan (1 fan = 1um), 50 fan, 75 fan and other specifications. Due to the excellent dielectric properties of PET, it has good anti-fouling, anti-scratch, high temperature resistance and other properties, it is widely used in many special occasions, such as electronic products produced under high temperature conditions, mobile phone batteries, computer monitors, air conditioning compressors wait.

Heat-resistant lead-free application series thermal transfer labels, especially suitable for harsh working environments with extremely high temperature requirements for labels in order to achieve international standards for industrialized lead-free processes. It is used for printed circuit boards or other electronic parts. ideal choice. High temperature resistant series of labels can be printed by thermal transfer, and exhibit the best PCS and first-class reading rate, exhibit superior chemical resistance and abrasion resistance, and resist various fluxes and melting agents at a high temperature of 270 degrees Chemical substances such as chemicals and detergents, as well as harsh environments of high temperature and wear, ensure excellent performance in various harsh and demanding application environments. It is the best choice to realize the lead-free process
1. Save your labeling cost and let you get the best cost performance.
2. The ultra-thin material structure is suitable for the whole process of processing, meeting the most stringent requirements in the solder paste screen printing process.
3. The ultra-thin feature is in line with the trend of miniaturization and high-density development of circuit boards for 3C products such as MP3.
4. It can withstand up to 270°C/12 minutes: no falling off, no deformation; resist corrosion of various chemical substances and various wear; maintain quality stability; meet the international standard of lead-free chemical industry process.